基于电流体动力喷射的多层柔性电路垂直互联结构打印技术研究*
王丹阳, 高振强, 靳茂鹏, 郭恒瑞, 白彦军, 王飞, 彭子龙
Printing of vertical interconnection structures for multilayer flexible circuits based on electrohydrodynamic jetting
WANG Danyang, GAO Zhenqiang, JIN Maopeng, GUO Hengrui, BAI Yanjun, WANG Fei, PENG Zilong
现代制造工程
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2024, (11): 37
-44
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DOI: 10.16731/j.cnki.1671-3133.2024.11.005