Printing of vertical interconnection structures for multilayer flexible circuits based on electrohydrodynamic jetting

WANG Danyang, GAO Zhenqiang, JIN Maopeng, GUO Hengrui, BAI Yanjun, WANG Fei, PENG Zilong

Modern Manufacturing Engineering . 2024, (11): 37 -44 . DOI: 10.16731/j.cnki.1671-3133.2024.11.005