面向三维电装工艺的PCBA模型快速构建技术

doi:10.16731/j.cnki.1671-3133.2025.09.015

现代制造工程 ›› 2025, Vol. 540 ›› Issue (9): 113-121.doi: 10.16731/j.cnki.1671-3133.2025.09.015

面向三维电装工艺的PCBA模型快速构建技术

侯霄宇¹, 黄少华¹, 郭宇¹, 王燕清², 孙浩¹, 王博宇¹, 张立童¹

1 南京航空航天大学机电学院,南京 210016;
2 中国电子科技集团公司第十四研究所,南京 210039

收稿日期:2024-12-02 出版日期:2025-09-18 发布日期:2025-09-23
通讯作者: 黄少华,博士,讲师,主要研究方向数字化设计与制造。
作者简介:侯霄宇,硕士研究生,主要研究方向为数字化设计与制造。郭宇,博士,教授,主要研究方向为智能制造系统与技术。王燕清,硕士,高级工程师,主要研究方向为板级电子装联工艺技术研究。孙浩,硕士研究生,主要研究方向为智能工艺规划。王博宇,硕士研究生,主要研究方向为智能制造系统与技术。张立童,博士研究生,主要研究方向为智能制造系统与技术。E-mail:hou_xy@nuaa.edu.cn。

The rapid construction technology of PCBA models for 3D electronic assembly process

HOU Xiaoyu¹, HUANG Shaohua¹, GUO Yu¹, WANG Yanqing², SUN Hao¹, WANG Boyu¹, ZHANG Litong¹

1 College of Mechanical and Electrical Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China;
2 The 14th Research Institute of China Electronics Technology Group Corporation,Nanjing 210039,China

Received:2024-12-02 Online:2025-09-18 Published:2025-09-23

摘要/Abstract

摘要： 电子制造业产品迭代迅速,对装配效率提出了更高的要求。印制电路板组件(PCBA)三维模型为装配工艺人员提供直观的工艺指导,但制造企业的PCBA图样仍广泛以二维图样形式存在,在展示电路板组件布局、连接方式和装配细节方面存在局限。然而,目前自动化的PCBA三维模型构建方法自动化程度不足,大量二维PCBA设计文件难以有效转化为三维模型。为解决电装工艺的三维可视化需求,提出基于参数化建模的PCBA模型快速构建技术。首先,根据三维电装工艺需求,定义了PCBA三维模型的结构化数据模型,通过对PCBA设计文件中的几何和位置信息进行参数提取,实现对设计文件的有效解析;然后,提出了元器件和印制电路板(PCB)的参数化特征建模方法;最后,通过参数化坐标匹配设计了元器件定位坐标算法,完成PCB与元器件的自动装配;最后,以某型号PCBA产品为应用实例,验证该建模方法的效率与准确性。研究结果表明,该方法可以高效构建精确PCBA三维模型,有助于指导装配工艺,提升制造效率。

关键词: 印制电路板组件, 三维电子装配, 自动建模, 装配工艺, 装配算法

Abstract: The rapid product iteration in the electronics manufacturing industry demands increased assembly efficiency. Three-Dimensional (3D) PCBA models offer intuitive guidance for assembly processes,yet most PCBA design files in manufacturing still exist as 2D drawings,which limits their ability to convey component layout,connectivity,and assembly details effectively. Current automated methods for constructing 3D PCBA models lack sufficient automation,making it challenging to transform numerous 2D design files into 3D models. This study introduced a parametric modeling-based technique for rapid 3D PCBA model construction to address the need for 3D visualization in electronic assembly. A structured data model was defined to meet the 3D assembly process requirements,facilitating the extraction of geometric and positional information from PCBA files for effective parsing. Subsequently,parametric feature modeling for components and PCB was proposed,followed by a coordinate-matching algorithm that enables automatic component positioning and PCB assembly. A case study validated the efficiency and accuracy of this method,showing its potential to construct precise 3D PCBA models efficiently,aiding assembly process guidance and enhancing manufacturing efficiency.

Key words: Printed Circuit Board Assembly (PCBA), 3D electronic assembly, automated modeling, assembly process, assembly algorithm

中图分类号:

TH164

侯霄宇, 黄少华, 郭宇, 王燕清, 孙浩, 王博宇, 张立童. 面向三维电装工艺的PCBA模型快速构建技术[J]. 现代制造工程, 2025, 540(9): 113-121.

HOU Xiaoyu, HUANG Shaohua, GUO Yu, WANG Yanqing, SUN Hao, WANG Boyu, ZHANG Litong. The rapid construction technology of PCBA models for 3D electronic assembly process[J]. Modern Manufacturing Engineering, 2025, 540(9): 113-121.

参考文献

[1] 陈新,陈云,陈桪,等.我国后端电子制造装备及其关键零部件发展研究[J].中国工程科学,2022,24(4):74-84.
[2] 陆洋,胡长明,成猛,等.基于数字化布线模型和工艺的电装总装实施[J].现代雷达,2022,44(2):95-99.
[3] 李建华,白岩柏.一种基于SolidWorks二次开发的三维交互辅助装配方法[J].现代制造工程,2020(1):83-87.
[4] 刘检华,孙连胜,张旭,等.三维数字化设计制造技术内涵及关键问题[J].计算机集成制造系统,2014,20(3):494-504.
[5] 韩钟剑,房建斌,李鹏程,等.电子设备仿真模型自动构建与验证[J].电子机械工程,2021,37(1):54-58.
[6] 丁来军,张瑜.MBD产品设计中的三维元器件装配设计方法研究[J].航空制造技术,2015(S1):71-75.
[7] 刘红军,李帅,周鸣.基于UG的PCB电路板自动装配技术的开发[J].制造业自动化,2011,33(19):24-26.
[8] 田源,王欣,许滨,等.基于SolidWorks二次开发的自动装配技术研究与应用[J].机械科学与技术,2012,31(5):703-707.
[9] 王炬成,张世超,戴震,等.二维图纸驱动三维建模的方法[J].船海工程,2024,53(3):23-28.
[10] 孙金,孙长乐,关广丰.基于二维工程图的三维CAD模型自动构建方法[J].计算机科学,2019,46(S2):42-46.
[11] SHENG B,YIN X,ZHANG C,et al.A rapid virtual assembly approach for 3D models of production line equipment based on the smart recognition of assembly features[J].Journal of Ambient Intelligence & Humanized Computing,2019,10(3):1257-1270.
[12] 邹元春,卢新明,李金龙,等.立井井筒装备关键构件参数建模及自动装配技术的研究与实现[J].煤炭工程,2021,53(4):11-15.
[13] SON S,NA S,KIM K,et al.Collaborative design environment between ECAD and MCAD engineers in high-tech products development[J].International Journal of Production Research,2014,52(20):6161-6174.
[14] JONG W R,CHEN Y W.The integration and application of MCAD and ECAD in the spatial design of electronic products[J].Journal of the Chinese Institute of Engineers,2019,42(4):279-289.
[15] 田健.全三维电装工艺系统关键技术研究[D].西安:西安电子科技大学,2018.
[16] IPC. Requirements for Soldered Electrical and Electronic Assemblies:IPC J-STD-001G[S].Bannockburn:IPC,2017.
[17] 黎海兵,张忠波,陈友鹏,等.支持产品变型设计的建模方法研究[J].现代制造工程,2022(10):63-67,26.
[18] LI J,LI X.Conventional missile structural configuration design based on secondary development of UG[M]//Advances in Engineering Materials and Applied Mechanics. [S.l.]:CRC Press,2015:37-42.
[19] XIANG L,SUN W L,HE L Y,et al.Application of Ug Re-Development Technology in 3-D Parameterized Modeling of Injection Mould Parts[J].Key Engineering Materials,2012,522:847-850.

面向三维电装工艺的PCBA模型快速构建技术

The rapid construction technology of PCBA models for 3D electronic assembly process

PDF

可视化

摘要/Abstract

引用本文

使用本文

参考文献

相关文章 2

编辑推荐

Metrics

[1]	郭喜锋, 梁文馨, 季宝宁, 蒋明杰, 陈伦. 基于大语言模型的装配工艺智能问答方法[J]. 现代制造工程, 2025, 540(9): 33-40.
[2]	赵哲, 杨滨赫, 张磊. 发动机转静子同轴度偏心工艺优化研究[J]. 现代制造工程, 2024, 520(1): 89-94.