关键词: 弯月面限域电化学沉积, 气压调控, 工艺参数, 电流密度, 沉积模式

Abstract: Electrochemical deposition technology is widely used in electroplating and electroforming. The mask-less processing method represented by meniscus confined electorochemical deposition is used to achieve nanoscale feature shaping by controlling the single deposition to a very small processing area by means of nanoscale probes or needles. When the deposition range is enlarged,it is difficult to precisely control the electrolyte flowing field over a large area,which leads to a decrease in the deposition accuracy. Therefore,the mask-based electrochemical deposition technology came into being. However,the high processing cost of high-precision masks and the inability to eliminate interlayer gradient defects limit the application of this technology in 3D structure processing. Therefore,it is of great significance to develop a mask-less electrochemical deposition technique applicable to a larger range. A new method for high-precision mask-less electrochemical deposition over a wide range of micro-meter scale was proposed by introducing an air pressure-constrained meniscus flow field. The control law of the range of the curved meniscus surface at the exit of the hollow electrode under different air pressures was investigated,and the influences of the key parameters such as voltage,gap width and electrolyte concentration on the processing accuracy and processing stability were explored,and the deposition modes under different combinations of the parameters were determined by the current density,which verified the validity of this current density range in the multilayer deposition.

Key words: MCED, air pressure regulation, process parameters, current density, deposition pattern