Fundamental mechanism of calibration coefficients considering the effect of the bonding process on the moiré interference drilling method

doi:10.16731/j.cnki.1671-3133.2024.07.001

Abstract

Abstract: The incremental hole drilling technique that combines moiré interferometry with the hole drilling method is recognized as an effective method for measuring internal residual stress.The bonding agent used in this technique plays a crucial role in transferring strain from the structure′s surface to the grating layer during the experimental process.However,the bonding agent′s influence is often not considered when solving for the calibration coefficient.Utilizing finite element software,the effects of the bonding agent on the calibration coefficient were investigated by considering five factors:material properties of the bonding agent,the shape and size of the bonding agent,the thickness of the bonding agent,the increment of hole drilling,and the strain measurement method.The impact of the bonding agent was demonstrated by comparing the calibration coefficient error with and without considering the bonding agent.Based on the results,it can be concluded that neglecting the bonding agent′s influence can significantly impact the calibration coefficient′s accuracy.Excluding the bonding agent from the finite element model will lead to underestimating the calibration coefficient.The error in the calibration coefficient exceeds 2.5 % and is highly dependent on the drilling increment and the measurement method.Furthermore,the effect of bonding agents on thin-walled components is more significant than on thicker samples.

Key words: incremental hole drilling technique, moiré interferometry, bonding agent, residual stress, finite element simulation

CLC Number:

ZHANG Keming, CAO Yu, XI Shangbin, ZHENG Pei, ZHANG Zhenya, HUANG Jia, LIU Wencheng, YAO Jun. Fundamental mechanism of calibration coefficients considering the effect of the bonding process on the moiré interference drilling method[J]. Modern Manufacturing Engineering, 2024, 526(7): 1-8.

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