Printing of vertical interconnection structures for multilayer flexible circuits based on electrohydrodynamic jetting

doi:10.16731/j.cnki.1671-3133.2024.11.005

Abstract

Abstract: Flexible stretchable electronics are widely used in fields such as wearable electronics and soft robots,etc.In order to achieve a high degree of integration,electronics between different layers,etc.,need to be connected together by vertical interconnections,and thus it is crucial to achieve stable vertical interconnections. A method that can directly print low-melting-point liquid metal columns by electrohydrodynamic jetting was proposed,which can realize vertical interconnections of flexible circuits. By controlling the printing parameters,different heights of metal risers can be printed to fabricate vertical intercon-nections of different heights. In order to test the stability and reliability of the vertical interconnection structure,the fabricated circuits with vertical interconnection channelsion were subjected to tensile and bending tests,respectively,which showed that the circuits had a stable resistance response under hundreds of bending and tensile cycles. A wireless induction coil with LED lights based on a multilayer structure was fabricated to demonstrate the capability of electro hydrodynamic jet printing for vertical interconnections.

Key words: vertical interconnections, multilayer flexible circuits, electrohydrodynamic jet printing, liquid metals

CLC Number:

TP16

WANG Danyang, GAO Zhenqiang, JIN Maopeng, GUO Hengrui, BAI Yanjun, WANG Fei, PENG Zilong. Printing of vertical interconnection structures for multilayer flexible circuits based on electrohydrodynamic jetting[J]. Modern Manufacturing Engineering, 2024, 530(11): 37-44.

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