现代制造工程 ›› 2024, Vol. 526 ›› Issue (7): 1-8.doi: 10.16731/j.cnki.1671-3133.2024.07.001

• 试验研究 •    下一篇

考虑黏接工艺对云纹干涉钻孔法标定系数基本机理的影响*

张克明1, 曹宇1, 席尚宾2, 郑佩1, 张振亚3, 黄甲4, 刘文城4, 姚骏5   

  1. 1 上海理工大学,上海 200093;
    2 上海交通大学,上海 200240;
    3 宁波工程学院建筑与交通工程学院,宁波 315211;
    4 西北工业大学民航学院,西安 710072;
    5 江苏集萃碳纤维及复合材料应用技术研究院有限公司,常州 213000
  • 收稿日期:2023-10-26 出版日期:2024-07-18 发布日期:2024-07-30
  • 通讯作者: 姚骏,主要研究方向为投影条纹。E-mail:yaojun@cfct-jitri.com
  • 作者简介:张克明,博士,副教授,主要研究方向为钻孔法、摄影测量、数字孪生、航空航天力学与测量。E-mail:zhangkeming@usst.edu.cn;曹宇,硕士研究生,主要研究方向为钻孔法残余应力测量。E-mail:1426085203@qq.com
  • 基金资助:
    *国家自然科学基金项目(11802316);国家商用飞机制造工程技术研究中心创新基金项目(COMAC-SFGS-2022-1874);常州市“龙城英才计划”项目(CQ20210045)

Fundamental mechanism of calibration coefficients considering the effect of the bonding process on the moiré interference drilling method

ZHANG Keming1, CAO Yu1, XI Shangbin2, ZHENG Pei1, ZHANG Zhenya3, HUANG Jia4, LIU Wencheng4, YAO Jun5   

  1. 1 University of Shanghai for Science and Technology,Shanghai 200093,China;
    2 Shanghai Jiao Tong University,Shanghai 200240,China;
    3 Ningbo University of Technology,Ningbo 315211,China;
    4 Northwestern Polytechnical University,Xi'an 710072,China;
    5 Jiangsu JITRI Carbon Fiber and Composite Application Technologies Research Institute Co.,Ltd., Changzhou 213000,China
  • Received:2023-10-26 Online:2024-07-18 Published:2024-07-30

摘要: 云纹干涉法与钻孔法相结合的增量钻孔技术被公认为是一种测量内部残余应力的有效方法。该技术中使用的黏接剂在试验过程中起着将应变从结构表面传递到光栅层的关键作用。然而,在求解标定系数时,往往没有考虑黏接剂的影响。基于有限元软件,从黏接剂的材料性质、粘接层的形状和尺寸、粘接层的厚度、钻孔的增量和应变测量方法5个方面考察了黏接剂对标定系数的影响。通过比较有无黏接剂时的标定系数误差,说明了黏接剂的影响。结果表明,忽略黏接剂的影响会显著影响标定系数的精度,将黏接剂从有限元模型中剔除会导致低估标定系数,标定系数的误差超过2.5 %,并且与钻孔增量和测量方法有很大关系。此外,黏接剂对薄壁构件的影响比对较厚的试件更显著。

关键词: 增量钻孔法, 云纹干涉法, 黏接剂, 残余应力, 有限元模拟

Abstract: The incremental hole drilling technique that combines moiré interferometry with the hole drilling method is recognized as an effective method for measuring internal residual stress.The bonding agent used in this technique plays a crucial role in transferring strain from the structure′s surface to the grating layer during the experimental process.However,the bonding agent′s influence is often not considered when solving for the calibration coefficient.Utilizing finite element software,the effects of the bonding agent on the calibration coefficient were investigated by considering five factors:material properties of the bonding agent,the shape and size of the bonding agent,the thickness of the bonding agent,the increment of hole drilling,and the strain measurement method.The impact of the bonding agent was demonstrated by comparing the calibration coefficient error with and without considering the bonding agent.Based on the results,it can be concluded that neglecting the bonding agent′s influence can significantly impact the calibration coefficient′s accuracy.Excluding the bonding agent from the finite element model will lead to underestimating the calibration coefficient.The error in the calibration coefficient exceeds 2.5 % and is highly dependent on the drilling increment and the measurement method.Furthermore,the effect of bonding agents on thin-walled components is more significant than on thicker samples.

Key words: incremental hole drilling technique, moiré interferometry, bonding agent, residual stress, finite element simulation

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